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| HD74AC368 Hex Inverter Buffer with 3-State Output REJ03D0272-0200Z (Previous ADE-205-393 (Z)) Rev.2.00 Jul.16.2004 Features * 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers * Outputs Source/Sink 24 mA * Ordering Information Part Name HD74AC368FPEL HD74AC368RPEL Package Type SOP-16 pin (JEITA) Package Code Package Abbreviation Taping Abbreviation (Quantity) FP-16DAV FP RP EL (2,000 pcs/reel) EL (2,500 pcs/reel) SOP-16 pin (JEDEC) FP-16DNV Notes: 1. Please consult the sales office for the above package availability. 2. The packages with lead-free pins are distinguished from the conventional products by adding V at the end of the package code. Pin Arrangement OE1 I O I O I O GND 1 2 3 4 5 6 7 8 (Top view) 16 VCC 15 OE2 14 I 13 O 12 I 11 O 10 I 9 O Rev.2.00, Jul.16.2004, page 1 of 5 HD74AC368 Logic Symbol OE I O Pin Names OE1, OE2 I O 3-State Output: Enable Input (Active Low) Inputs Outputs Truth Table Inputs OE L L H H L X Z : : : : High Voltage Level Low Voltage Level Immaterial High Impedance L H X I H L Z Output O Absolute Maximum Ratings Item Supply voltage DC input diode current DC input voltage DC output diode current DC output voltage DC output source or sink current DC VCC or ground current per output pin Storage temperature Symbol VCC IIK VI IOK VO IO ICC, IGND Tstg Ratings -0.5 to 7 -20 20 -0.5 to Vcc+0.5 -50 50 -0.5 to Vcc+0.5 50 50 -65 to +150 Unit V mA mA V mA mA V mA mA C Condition VI = -0.5V VI = Vcc+0.5V VO = -0.5V VO = Vcc+0.5V Recommended Operating Conditions Item Supply voltage Input and Output voltage Operating temperature Input rise and fall time (except Schmitt inputs) VIN 30% to 70% VCC Symbol VCC VI, VO Ta tr, tf Ratings 2 to 6 0 to VCC -40 to +85 8 V V C ns/V VCC = 3.0V VCC = 4.5 V VCC = 5.5 V Unit Condition Rev.2.00, Jul.16.2004, page 2 of 5 HD74AC368 DC Characteristics Item Symbol VIH Vcc (V) 3.0 4.5 5.5 VIL 3.0 4.5 5.5 3.0 4.5 5.5 3.0 4.5 VOL 5.5 3.0 4.5 5.5 3.0 4.5 Input leakage current 3 State current IIN IOZ 5.5 5.5 5.5 min. 2.1 3.15 3.85 -- -- -- 2.9 4.4 5.4 2.58 3.94 4.94 -- -- -- -- -- -- -- -- Ta = 25C typ. 1.5 2.25 2.75 1.50 2.25 2.75 2.99 4.49 5.49 -- -- -- 0.002 0.001 0.001 -- -- -- -- -- max. -- -- -- 0.9 1.35 1.65 -- -- -- -- -- -- 0.1 0.1 0.1 0.32 0.32 0.32 0.1 0.5 Ta = -40 to +85C min. max. 2.1 -- 3.15 3.85 -- -- -- 2.9 4.4 5.4 2.48 3.80 4.80 -- -- -- -- -- -- -- -- -- -- 0.9 1.35 1.65 -- -- -- -- -- -- 0.1 0.1 0.1 0.37 0.37 0.37 1.0 5.0 A A V VOUT = 0.1 V or VCC -0.1 V Unit Condition Input Voltage V VOUT = 0.1 V or VCC -0.1 V Output voltage VOH VIN = VIL or VIH IOUT = -50 A VIN = VIL or VIH IOH = -12 mA IOH = -24 mA IOH = -24 mA VIN = VIL or VIH IOUT = 50 A VIN = VIL or VIH IOL = 12 mA IOL = 24 mA IOL = 24 mA VIN = VCC or GND VIN(OE) = VIL, VIH VIN = VCC or GND VOUT = VCC or GND VOLD = 1.1 V VOHD = 3.85 V VIN = VCC or ground Dynamic output current* Quiescent supply current IOLD IOHD ICC 5.5 5.5 5.5 -- -- -- -- -- -- -- -- 8.0 86 -75 -- -- -- 80 mA mA A *Maximum test duration 2.0 ms, one output loaded at a time. AC Characteristics Ta = +25C CL = 50 pF Item Propagation delay Propagation delay Enable time Enable time Disable time Disable time Note: Symbol tPLH tPHL tZH tZL tHZ tLZ VCC (V)*1 Min 3.3 1.0 5.0 3.3 5.0 3.3 5.0 3.3 5.0 3.3 5.0 3.3 5.0 1. Voltage Range 3.3 is 3.3 V 0.3 V Voltage Range 5.0 is 5.0 V 0.5 V 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 Typ 7.0 5.0 7.0 4.5 9.0 7.0 10.0 7.5 9.5 7.5 9.0 7.0 Max 9.0 7.0 9.0 7.0 13.0 9.5 12.5 10.0 12.0 10.0 12.5 10.0 Ta = -40C to +85C CL = 50 pF Min 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 Max 10.0 7.5 10.0 7.5 13.5 10.0 13.5 10.5 12.5 10.5 13.5 10.5 Unit ns ns ns ns ns ns Rev.2.00, Jul.16.2004, page 3 of 5 HD74AC368 Capacitance Item Input capacitance Power dissipation capacitance Symbol CIN CPD 4.5 40.0 Typ pF pF Unit VCC = 5.5 V VCC = 5.0 V Condition Rev.2.00, Jul.16.2004, page 4 of 5 HD74AC368 Package Dimensions As of January, 2003 10.06 10.5 Max 16 9 5.5 Unit: mm 1 *0.20 0.05 8 0.80 Max 2.20 Max 0.20 7.80 + 0.30 - 1.15 1.27 0.10 0.10 0 - 8 0.70 0.20 *0.40 0.06 0.15 0.12 M Package Code JEDEC JEITA Mass (reference value) FP-16DAV -- Conforms 0.24 g *Ni/Pd/Au plating As of January, 2003 Unit: mm 9.9 10.3 Max 16 9 3.95 1 1.27 0.635 Max 8 0.11 0.14 + 0.04 - 1.75 Max *0.20 0.05 0.10 6.10 + 0.30 - 1.08 0 - 8 + 0.67 0.60 - 0.20 *0.40 0.06 0.15 0.25 M *Ni/Pd/Au plating Package Code JEDEC JEITA Mass (reference value) FP-16DNV Conforms Conforms 0.15 g Rev.2.00, Jul.16.2004, page 5 of 5 Sales Strategic Planning Div. Keep safety first in your circuit designs! Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein. RENESAS SALES OFFICES Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500 Fax: <1> (408) 382-7501 Renesas Technology Europe Limited. Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, United Kingdom Tel: <44> (1628) 585 100, Fax: <44> (1628) 585 900 Renesas Technology Europe GmbH Dornacher Str. 3, D-85622 Feldkirchen, Germany Tel: <49> (89) 380 70 0, Fax: <49> (89) 929 30 11 Renesas Technology Hong Kong Ltd. 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2375-6836 Renesas Technology Taiwan Co., Ltd. FL 10, #99, Fu-Hsing N. Rd., Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. 26/F., Ruijin Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. 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